(sigemb-info 109) IESS 07: Call for Papers

[Hiroyuki Tomiyama <hiroyuki@xxxxxxx>]

(Apologies for multiple postings)

Call for Papers

International Embedded Systems Symposium (IESS) 2007

www.iess.org

Beckmann Center in Irvine, CA (USA)
May 29. - June 1. 2007

Supported by the IFIP WG 10.5
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CALL FOR PAPERS
Deadline for Submission: December 20. 2006
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CONFERENCE THEME:
Over recent years, embedded systems have gained an enormous amount of
processing power and functionality. Many of the formerly external
components can now be integrated into a single System-on-Chip. This
tendency has resulted in a dramatic reduction in the size and cost of
embedded systems. As a unique technology, the design of embedded systems
is an essential element of many innovations.
Embedded systems meet their performance goals, including real-time
constraints, through a combination of special-purpose hardware and
software components tailored to the system requirements. Both the
development of new features and the reuse of existing intellectual
property components are essential to keeping up with ever demanding
customer requirements. Furthermore, design complexities are steadily
growing with an increasing number of components that have to cooperate
properly. Embedded system designers have to cope with multiple goals and
constraints simultaneously, including timing, power, reliability,
dependability, maintenance, packaging and, last but not least, price.
The significance of these constraints varies depending on the
application area a system is targeted for. Typical embedded applications
include multi-media, automotive, medical, and communication devices.

The goals of the International Embedded Systems Symposium are to present
exchange and discuss the state of the art, novel ideas, actual research
results, and future trends in the field of embedded systems.
Contributors and participants from both industry and academia are
encouraged to take active part in this symposium.
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TOPICS: Topics include, but are not restricted to the following:

- Specification and modeling of embedded systems
- Design methodology for embedded systems
- Validation and verification of embedded systems
- New technologies and trends for embedded systems
- Hardware/software co-design
- Re-configurable architectures and applications
- Software synthesis for embedded systems
- Distributed and modular controller architectures
- Network and communication systems
- Dependability and fault tolerance
- Power management and optimization
- Medical applications
- Case studies of actual embedded systems
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IMPORTANT DATES:
Submissions due: December 20. 2006
Notification of acceptance: January 20. 2007
Final papers: February 20. 2007
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SUBMISSIONS:
A submission should consist of:
- a cover page including: most appropriate topic, title of the paper,
names and affiliations of authors, contact author's name, address, phone
number, fax number, and email address
- the paper (up to 10 pages in 11 point or larger) or an abstract (3 - 5
pages), which should provide a summary of the main results and their
details to allow the program committee to assess their merits and
significance, including references and comparisons.
The contribution must be unpublished and not submitted for publication
elsewhere, including journals and the proceedings of other symposia or
workshops. One author of each accepted paper should present it at the
conference. The Proceedings will be published by Springer, the official
publisher of IFIP. Full details on how to format your paper can be found
at at the IESS 2005 web site www.iess.org or the web site of the
conference publisher, Springer:
www.wkap.com/ifip/styles/
Download the Copyright form and fax to Achim Rettberg, Fax: +49 (5251)
606066.
You can submit Postscript, PDF, or MS Word files to:
- e-mail: iess@xxxxxxxx
- or hard copies to:
mail: Achim Rettberg
University Paderborn
Fuerstenallee 11
D-33094 Paderborn
Germany
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ORGANIZING COMMITEE::
General Chairs:
- Achim Rettberg, University Paderborn, achim@xxxxxxxx
- Mauro César Zanella, ZF Lemförder Fahrwerktechnik GmbH & Co. KG,
mauro.zanella@xxxxxx
General Co-Chair:
- Prof. Franz J. Rammig, University Paderborn, franz@xxxxxx
Program Chair
- Rainer Doemer, University of California, Irvine, doemer@xxxxxxx
Local Arrangements Chair
- Andreas Gerstlauer, University of California, Irvine,
gerstlauer@xxxxxxxxxxxx
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PROGRAMM COMMITEE:
Richard Anthony -- The University of Greenwich, England
Samar Abdi -- University of California at Irvine, USA
Jürgen Becker -- University Karlsruhe, Germany
Brandon Blodget -- Xilinx Research Labs, USA
Christophe Bobda -- University Kaiserslautern, Germany
Rainer Doemer -- University of California at Irvine, USA
Cecilia Ekelin -- Volvo Technology Corporation, Sweden
Rolf Ernst -- Technical University Braunschweig, Germany
Masahiro Fujita -- University of Tokyo, Japan
Andreas Gerstlauer -- University of California at Irvine, USA
Frank Hansen -- Altera, Germany
Joerg Henkel -- University Karlsruhe, Germany
Thomas Heurung -- Mentor Graphics, Germany
Uwe Honekamp -- Vector Informatik, Germany
Marcel Jackowski -- USP, Brazil
Kane Kim -- University of California at Irvine, USA
Bernd Kleinjohann -- C-LAB, Germany
Thorsten Koelzow -- Audi Electronics Venture, Germany
Hermann Kopetz -- Technical University Vienna, Austria
Horst Krimmel -- ZF Friedrichshafen, Germany
Jean-Claude Laprie -- LAAS, France
Thomas Lehmann -- Philips, Germany
Roger May -- Altera, England
Mike Olivarez -- Freescale Semiconductor, USA
Frank Oppenheimer, OFFIS, Germany
Carlos Pereira -- UFRGS, Brazil
Franz Rammig -- University Paderborn, Germany
Achim Rettberg -- C-LAB, Germany
Stefan Schimpf -- Robert Bosch Ltda., Brazil
Juergen Schirmer -- Robert Bosch GmbH, Stuttgart, Germany
Aviral Shrivastava -- Arizona State University, USA
Joachim Stroop -- dSPACE, Germany
Hiroyuki Tomiyama -- Nagoya University, Japan
Ansgar Traechtler -- University Paderborn, Germany
Flavio R. Wagner -- UFRGS, Brazil
Mauro Zanella -- ZF Lemförder Fahrwerktechnik, Germany
Jianwen Zhu -- University of Toronto, Canada