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(sigemb-info 158) 論文募集:SPLC 2007 (deadline 02/28)
- To: sigemb-info@xxxxxxx
- From: Tomoji Kishi <tkishi@xxxxxxxxxxx>
- Date: Tue, 20 Feb 2007 02:26:08 +0900
北陸先端大学の岸と申します。本メーリングリストをお借りして
ソフトウェアプロダクトライン国際会議の論文募集をお送りいたします。
#以前にも流させていただきましたが、締め切りが近くなりましたので、
再送させていただきます。ご容赦ください。
今年度のSPLCは京都で 9/10-14の間に開催されます。
http://sec.ipa.go.jp/SPLC2007/
論文の締め切りは 2月28日 となっています。
皆様の積極的な投稿をお待ちしております。
********************************************************
C A L L F O R P A P E R S
11th International
Software Product Line Conference
S P L C 2 0 0 7
Kyoto (Japan), 10 - 14 September 2007
http://sec.ipa.go.jp/SPLC2007/
********************************************************
Submission Deadlines:
Paper submission (firm!) Feb 28, 2007
Author notification Apr 19, 2007
Camera ready paper deadline (firm!) Apr 30, 2007
********************************************************
With SPLC 2007, *the* premier forum for practitioners,
researchers and educators to present and discuss the
most recent ideas, innovations, trends, experiences,
and concerns in the area software product lines and
software product family engineering comes to Asia for
the first time .
The objective is to continue the dialogue between software
product line practitioners and researchers on the benefits,
obstacles, and weaknesses of applying software product line
principles, techniques, methods, processes, and tools in
an industrial or organizational setting.
********************************************************
Scope:
Topics of interest of SPLC 2007 include, but are definitely
not restricted to:
* Industrial experiences in product line engineering
* Techniques and tools for product line engineering
* Evolution of product line assets
* Business issues for product lines
* Organizational and process issues for product lines
* Product line life-cycle issues
We invite three classes of original, unpublished
submissions:
(1) RESEARCH PAPERS describe original research
contribution (theoretical, conceptual) to the field
of software product line engineering. A research paper
should clearly describe the problem that has been
tackled, the state of the art with respect to the
problem, the solution that is suggested and the
potential -- or even better the evaluated -- benefits
of the contribution.
We also call for short research papers, which are
intended to report ideas in their early stages,
and are not required to show complete/evaluated result.
(2) EXPERIENCE PAPERS describe the history of a
software product line accompanied by a critical review
of experience within one or more development phases
within family and/or application engineering. An
experience report describes lessons learned in domains
of specific industries like automobile, mobile communication,
embedded controller, or enterprise SW
We also call for short experience papers: Short experience
papers are intended to report their useful and informative
experiences briefly, and highlight their main interesting
points.
(3) POSTERS describes research result or on-going research
projects. They are displayed in a dedicated poster area
at the conference, and presented in poster sessions.
Poster papers will appear in a separate proceedings.
********************************************************
Review Process:
At least three members of the SPLC 2007 program
committee will review each submission. The reviews
will be the basis for making final decisions about which
submissions to accept for presentation at the
conference.
********************************************************
Accepted Submissions:
Each accepted paper submission will be allotted a maximum of
ten pages (full papers) or six pages (short papers)
in the conference proceedings. The final
version of accepted papers must conform to the
proceedings publication format.
Authors are required to present their work in a technical
session.
Each accepted poster submission will allotted two pages
in the separate proceedings. Poster format will be
announced to accepted authors.
Authors are required to present their work in poster
sessions.
PC members will vote for the best paper from full papers,
but no paper may be selected if there is no agreement on
the best paper.
********************************************************
Submission Guidelines:
Papers should be submitted in PDF format. The results
described must be unpublished and should not be under
review elsewhere.
Submitted papers must conform to the IEEE proceeding
8.5x11-inche, Two-Column Format (*), and should not exceed
ten pages (including all text, figures, references and
appendices).
(*) http://www.computer.org/portal/site/cscps/index.jsp
INFORMATION FOR AUTHORS -> Formatting
Short research/experience papers are also conform the
same format, and should not exceed six pages.
Poster papers are also conform the same format, and
should not exceed two pages.
The submission deadline is firm! If you are unable to submit
a paper electronically, please contact one of the two chairs
at least two weeks prior to the submission deadline.
********************************************************
Contact:
For more information about submissions, feel free to
contact Tomoji Kishi (tkishi@xxxxxxxxxxx) and
Dirk Muthig (dirk.muthig@xxxxxxxxxxxxxxxxxx).
********************************************************
Organization:
GENERAL CHAIR
Kyo Kang (kck@xxxxxxxxxxxxx)
POSTECH, Korea
PROGRAM CHAIRS:
Tomoji Kishi (tkishi@xxxxxxxxxxx)
JAIST, Japan
Dirk Muthig (dirk.muthig@xxxxxxxxxxxxxxxxxx)
Fraunhofer IESE, Germany
WORKSHOP CHAIR
Peter Knauber (p.knauber@xxxxxxxxxxxxxx)
Mannheim University of Applied Science, Germany
TUTORIAL CHAIR
Charles Krueger (ckrueger@xxxxxxxxxxxx)
BigLever Software Inc., USA
PANEL CHAIR
Jim Dager (jim.c.dager@xxxxxxxxxxx)
Cummins Inc., USA
DEMONSTRATION CHAIR
Stan Jarzabek (stan@xxxxxxxxxxxxxxx)
National University of Singapore, Singapore
DOCTORIAL SYMPOSIUM CHAIR
Jaejoon Lee (Jaejoon.Lee@xxxxxxxxxxxxxxxxxx)
IESE, Fraunhofer, Germany
********************************************************
PROGRAM COMMITTEE:
Gary Chastek, SEI, USA
Paul Clements, SEI,USA
Sholom Cohen, SEI, USA
Krysztof Czarnecki, University of Waterloo, Canada
Stefania Gnesi, ISTI-CNR, Italy
Hassan Gomaa, George Mason University, USA
Masayuki Hirayama, IPA/SEC, Japan
Stan Jarzabek, National University of Singapore, Singapore
Jean-Marc Jezequel, IRSIA, France
Isabel John, Fraunhofer IESE, Germany
Michael Kircher, Siemens, Germany
Charles W. Krueger, Biglever, USA
Kwanwoo Lee, Hansung University, South Korea
John D. McGregor, Clemson University, USA
Natsuko, Noda, NEC Corp. / JAIST, Japan
Sooyong Park, SOGANG University, South Korea
Klaus Pohl, Lero, Ireland and SSE, University of Duisburg-Essen,
Germany
Klaus Schmid, University of Hildesheim, Germany
Andre van der Hoek, University of California, USA
Frank van der Linden, Philips, The Netherlands
Rob van Ommering, Philips, The Netherlands
Karl Reed, La Trobe University, Australia
Martin Verlage, Vereinigte Wirtschaftsdienste, Germany
David M. Weiss, Avaya, USA
Kentaro Yoshimura, Hitachi Europe, France
********************************************************
----- きしともじ Tomoji KISHI: 岸知二
北陸先端科学技術大学院大学 情報科学研究科
TEL: 0761-51-1326, FAX: 0761-51-1149