(sigemb-info 241) CFP: COOL Chips XI

[Keiji Kimura <kimura@xxxxxxxxxxxxxxxxxxxx>]

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木村＠早大   COOL Chips XI PC Vice Chair,

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Call For Paper
IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XI
April 16-18, 2008
Yokohama, Japan

IMPORTANT DEADLINES:

-Technical Papers:
          Extended Abstract Submission: January 17, 2008
          Author Notification:          March  3, 2008
          Final Manuscript Submission:  March 21, 2008

-Posters:
          Proposal Submission:          March 10, 2008

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COOL Chips is an International Symposium initiated in 1998 to present 
advancement of low-power and high-speed chips. The symposium covers 
leading-edge technologies in all areas of microprocessors and their 
applications. 

COOL Chips XI is to be held in Yokohama on April 16-18, 2008, and is 
targeted at the architecture, design and implementation of chips with 
special emphasis on the areas listed below. The COOL Chips Organizing 
Committee will ask the MICRO to publish selected papers in a special 
issue on COOL Chips XI.

Contributions are solicited in the following areas:

- Low Power-High Performance Processors for
Multimedia, Digital Consumer Electronics, Mobile, Graphics, 
Encryption, Robotics, Networking  and Biometrics.

- Novel Architectures and Schemes for
Single Core, Multi-Core, Embedded System, Reconfigurable Computing, 
Grid, Ubiquitous, Dependable Computing and Wireless.

- Cool Software including
Binary Translations, Compiler Issues and Low Power Techniques.

Technical papers:
  Proposals should consist of a title, an extended abstract (up to 3
  pages) describing the product or topic to be presented and the name, job
  title, address, phone number, FAX number, and e-mail address of the 
  presenter.  The status of the product or topic should precisely be 
  described.  If this is a not-yet-announced product, and you would like 
  to keep the submission confidential, please indicate it.  We will do our 
  best to maintain confidentiality.  Proposals will be selected by the 
  program committee's evaluation of interest to the audience.  Submission 
  should be made by e-mail, to: Makoto Ikeda, Program Co-Chair    
            submit_xi@xxxxxxxxxxxxx

Posterns:
Submission should be made by e-mail to: Toshinori Sato, Poster Chair
            poster_xi@xxxxxxxxxxxxx

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IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XI
                Yokohama Joho Bunka Center, Yokohama, Japan
     (Yokohama Media & Communications Center, Yokohama, Japan)
                             April 16 - 18, 2008
                        http://www.coolchips.org/
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-- 
Keiji Kimura <kimura@xxxxxxxxxxxxxxxxxxxx>