(sigemb-info 246) Re: CFP: COOL Chips XI

[Keiji Kimura <kimura@xxxxxxxxxxxxxxxxxxxx>]

再度 ML を御借りして，COOL Chips XIの論文募集の案内を送
付させていただきます．extended abstract の投稿締め切りが
       ＊1月17日（木）＊
となっております．

みなさまのご投稿をお待ちしております．

木村＠早大   COOL Chips XI PC Vice Chair,

At Wed, 05 Dec 2007 21:56:33 +0900,
Keiji Kimura wrote:
> 
> ML をお借りして，COOL Chips XI の論文募集の案内を送付させてい
> ただきます．複数お受け取りの方は御容赦下さい．
> 
> 是非，投稿をご検討くださいますようにお願いいたします．
> 
> 木村＠早大   COOL Chips XI PC Vice Chair,
> 
> -------------------------------------------------------------------------
> Call For Paper
> IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XI
> April 16-18, 2008
> Yokohama, Japan
> 
> IMPORTANT DEADLINES:
> 
> -Technical Papers:
>           Extended Abstract Submission: January 17, 2008
>           Author Notification:          March  3, 2008
>           Final Manuscript Submission:  March 21, 2008
> 
> -Posters:
>           Proposal Submission:          March 10, 2008
> 
> -------------------------------------------------------------------------
> COOL Chips is an International Symposium initiated in 1998 to present 
> advancement of low-power and high-speed chips. The symposium covers 
> leading-edge technologies in all areas of microprocessors and their 
> applications. 
> 
> COOL Chips XI is to be held in Yokohama on April 16-18, 2008, and is 
> targeted at the architecture, design and implementation of chips with 
> special emphasis on the areas listed below. The COOL Chips Organizing 
> Committee will ask the MICRO to publish selected papers in a special 
> issue on COOL Chips XI.
> 
> Contributions are solicited in the following areas:
> 
> - Low Power-High Performance Processors for
> Multimedia, Digital Consumer Electronics, Mobile, Graphics, 
> Encryption, Robotics, Networking  and Biometrics.
> 
> - Novel Architectures and Schemes for
> Single Core, Multi-Core, Embedded System, Reconfigurable Computing, 
> Grid, Ubiquitous, Dependable Computing and Wireless.
> 
> - Cool Software including
> Binary Translations, Compiler Issues and Low Power Techniques.
> 
> Technical papers:
>   Proposals should consist of a title, an extended abstract (up to 3
>   pages) describing the product or topic to be presented and the name, job
>   title, address, phone number, FAX number, and e-mail address of the 
>   presenter.  The status of the product or topic should precisely be 
>   described.  If this is a not-yet-announced product, and you would like 
>   to keep the submission confidential, please indicate it.  We will do our 
>   best to maintain confidentiality.  Proposals will be selected by the 
>   program committee's evaluation of interest to the audience.  Submission 
>   should be made by e-mail, to: Makoto Ikeda, Program Co-Chair    
>             submit_xi@xxxxxxxxxxxxx
> 
> Posterns:
> Submission should be made by e-mail to: Toshinori Sato, Poster Chair
>             poster_xi@xxxxxxxxxxxxx
> 
> -------------------------------------------------------------------------
> IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XI
>                 Yokohama Joho Bunka Center, Yokohama, Japan
>      (Yokohama Media & Communications Center, Yokohama, Japan)
>                              April 16 - 18, 2008
>                         http://www.coolchips.org/
> -------------------------------------------------------------------------
> 
> -- 
> Keiji Kimura <kimura@xxxxxxxxxxxxxxxxxxxx>
> 
>