(sigemb-info 129) CFP: COOL Chips X

[Keiji Kimura <kimura@xxxxxxxxxxxxxxxxxxxx>]

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木村＠早大   COOL Chips X PC Vice Chair,

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Call For Paper
IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips X
April 18-20, 2007
Yokohama, Japan

IMPORTANT DEADLINES:

-Technical Papers:
          Extended Abstract Submission: January 19, 2007
          Author Notification:          March  5, 2007
          Final Manuscript Submission:  March 23, 2007

-Posters:
          Proposal Submission:          March 12, 2007

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COOL Chips is an International Symposium initiated in 1998 to present 
advancement of low-power and high-speed chips. The symposium covers 
leading-edge technologies in all areas of microprocessors and their 
applications. 

COOL Chips X is to be held in Yokohama on April 18-20, 2007, and is 
targeted at the architecture, design and implementation of chips with 
special emphasis on the areas listed below. The COOL Chips Organizing 
Committee will ask the MICRO to publish selected papers in a special 
issue on COOL Chips X.

Contributions are solicited in the following areas:

- Low Power-High Performance Processors for
Multimedia, Digital Consumer Electronics, Mobile, Graphics, 
Encryption, Robotics, Networking  and Biometrics.

- Novel Architectures and Schemes for
Single Core, Multi-Core, Embedded System, Reconfigurable Computing, 
Grid, Ubiquitous, Dependable Computing and Wireless.

- Cool Software including
Binary Translations, Compiler Issues and Low Power Techniques.

- 10th Anniversary Special Topics:
Low Power, High Performance and High Efficiency Supercomputing.

Technical papers:
  Proposals should consist of a title, an extended abstract (up to 3
  pages) describing the product or topic to be presented and the name, job
  title, address, phone number, FAX number, and e-mail address of the 
  presenter.  The status of the product or topic should precisely be 
  described.  If this is a not-yet-announced product, and you would like 
  to keep the submission confidential, please indicate it.  We will do our 
  best to maintain confidentiality.  Proposals will be selected by the 
  program committee's evaluation of interest to the audience.  Submission 
  should be made by e-mail, to: Makoto Ikeda, Program Vice Chair    
            submit_X@xxxxxxxxxxxxx

Posterns:
Submission should be made by e-mail to: Toshinori Sato, Poster Chair
            poster_X@xxxxxxxxxxxxx

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IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips X
                Yokohama Joho Bunka Center, Yokohama, Japan
     (Yokohama Media & Communications Center, Yokohama, Japan)
                             April 18 - 20, 2007
                        http://www.coolchips.org/
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