(sigemb-info 149) Re: CFP: COOL Chips X

[Keiji Kimura <kimura@xxxxxxxxxxxxxxxxxxxx>]

早大 木村です．重複して受け取られた方は御容赦下さい．

ML をお借りしてCOOL Chips Xのextendedabstraction締め切り延長
のお知らせをいたします．

多くのご要望により， extended abstraction (1000word程度）の
締め切りを1/19から1/26に延長いたしました．この機会に，是非と
も投稿のご検討をお願いしたく存じます．特に，マルチコアプロセッ
サや低消費電力等の組込み向けアーキテクチャ・ソフトウェアをご
研究の皆様からの投稿をお待ちしています．

At Tue, 09 Jan 2007 14:32:20 +0900,
Keiji Kimura wrote:
> 
> 再度 ML を御借りして，COOL Chips Xの論文募集の案内を送付させ
> ていただきます．extended abstract の投稿締め切りが
>        ＊1月19日（金）＊
> となっております．
> 
> みなさまのご投稿をお待ちしております．
> 
> 木村＠早大   COOL Chips X PC Vice Chair,
> 
> At Fri, 08 Dec 2006 17:05:18 +0900,
> Keiji Kimura wrote:
> > 
> > ML をお借りして，COOL Chips X の論文募集の案内を送付させてい
> > ただきます．複数お受け取りの方は御容赦下さい．
> > 
> > 是非，投稿をご検討くださいますようにお願いいたします．
> > 
> > 木村＠早大   COOL Chips X PC Vice Chair,
> > 
> > -------------------------------------------------------------------------
> > Call For Paper
> > IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips X
> > April 18-20, 2007
> > Yokohama, Japan
> > 
> > IMPORTANT DEADLINES:
> > 
> > -Technical Papers:
> >           Extended Abstract Submission: January 19, 2007
> >           Author Notification:          March  5, 2007
> >           Final Manuscript Submission:  March 23, 2007
> > 
> > -Posters:
> >           Proposal Submission:          March 12, 2007
> > 
> > -------------------------------------------------------------------------
> > COOL Chips is an International Symposium initiated in 1998 to present 
> > advancement of low-power and high-speed chips. The symposium covers 
> > leading-edge technologies in all areas of microprocessors and their 
> > applications. 
> > 
> > COOL Chips X is to be held in Yokohama on April 18-20, 2007, and is 
> > targeted at the architecture, design and implementation of chips with 
> > special emphasis on the areas listed below. The COOL Chips Organizing 
> > Committee will ask the MICRO to publish selected papers in a special 
> > issue on COOL Chips X.
> > 
> > Contributions are solicited in the following areas:
> > 
> > - Low Power-High Performance Processors for
> > Multimedia, Digital Consumer Electronics, Mobile, Graphics, 
> > Encryption, Robotics, Networking  and Biometrics.
> > 
> > - Novel Architectures and Schemes for
> > Single Core, Multi-Core, Embedded System, Reconfigurable Computing, 
> > Grid, Ubiquitous, Dependable Computing and Wireless.
> > 
> > - Cool Software including
> > Binary Translations, Compiler Issues and Low Power Techniques.
> > 
> > - 10th Anniversary Special Topics:
> > Low Power, High Performance and High Efficiency Supercomputing.
> > 
> > Technical papers:
> >   Proposals should consist of a title, an extended abstract (up to 3
> >   pages) describing the product or topic to be presented and the name, job
> >   title, address, phone number, FAX number, and e-mail address of the 
> >   presenter.  The status of the product or topic should precisely be 
> >   described.  If this is a not-yet-announced product, and you would like 
> >   to keep the submission confidential, please indicate it.  We will do our 
> >   best to maintain confidentiality.  Proposals will be selected by the 
> >   program committee's evaluation of interest to the audience.  Submission 
> >   should be made by e-mail, to: Makoto Ikeda, Program Vice Chair    
> >             submit_X@xxxxxxxxxxxxx
> > 
> > Posterns:
> > Submission should be made by e-mail to: Toshinori Sato, Poster Chair
> >             poster_X@xxxxxxxxxxxxx
> > 
> > -------------------------------------------------------------------------
> > IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips X
> >                 Yokohama Joho Bunka Center, Yokohama, Japan
> >      (Yokohama Media & Communications Center, Yokohama, Japan)
> >                              April 18 - 20, 2007
> >                         http://www.coolchips.org/
> > -------------------------------------------------------------------------
> > 
>