(sigemb-info 698) CFP IESS 2013 - Deadline extension: Dec. 23, 2012

[Eiichi HAYAKAWA <hayakawa@xxxxxxxxxxxxxxxxxxxx>]

各位

幹事の拓殖大学 早川です。

立命館大学の冨山先生より下記の連絡をいただきましたので，

転送します。皆様ご検討よろしくお願いします。

--
Eiichi HAYAKAWA
Takushoku University
http://www.cs.takushoku-u.ac.jp/os/

-----------------

[apologies for cross-postings]

*** Deadline Extension ***

International Embedded Systems Symposium (IESS) 2013
June 17 – 19, 2013
Paderborn, Germany
http://www.iess.org/
http://www.facebook.com/InternationalEmbeddedSystemsSymposium

Important Dates
---------------
- Paper Submissions: December 23, 2012
- Acceptance of Notifications: February 18, 2013
- Camera Ready Papers: March 11, 2013
- Symposium Dates: June 17-19, 2013

Conference Theme
----------------
Over recent years, embedded systems have gained an enormous amount of
processing
power and functionality. Many of the formerly external components can now be
integrated into a single System-on-Chip. This tendency has resulted in
a dramatic
reduction in the size and cost of embedded systems. As a unique technology, the
design of embedded systems is an essential element of many innovations.
Embedded systems meet their performance goals, including real-time constraints,
through a combination of special-purpose hardware and software components
tailored to the system requirements. Both the development of new features and
the reuse of existing intellectual property components are essential to keeping
up with ever demanding customer requirements. Furthermore, design complexities
are steadily growing with an increasing number of components that have to
cooperate properly. Embedded system designers have to cope with multiple goals
and constraints simultaneously, including timing, power, reliability,
dependability, maintenance, packaging and, last but not least, price. The
significance of these constraints varies depending on the application area a
system is targeted for. Typical embedded applications include multi-media,
automotive, medical, and communication devices.
The goals of the International Embedded Systems Symposium are to present
exchange and discuss the state of the art, novel ideas, actual
research results,
and future trends in the field of embedded systems. Contributors and
participants
from both industry and academia are encouraged to take active part in this
symposium.

Topics
- Specification and modeling of embedded systems
- Design methodology for embedded systems
- Validation and verification of embedded systems
- New technologies and trends for embedded systems
- Hardware/software co-design
- Re-configurable architectures and applications
- Software synthesis for embedded systems
- Distributed and modular controller architectures
- Network and communication systems
- Dependability and fault tolerance
- Power management and optimization
- Automotive, Avionic and Medical applications
- Case studies of innovative embedded systems
- Visualization for embedded systems

Submission
----------
The Proceedings will be published by Springer, the official publisher of IFIP.
IMPORTANT: Springer changed the layout for the IFIP series. Full details on how
to format your paper can be found at the web site of the conference publisher
Springer (http://www.springer.com/computer/lncs?SGWID=0-164-7-72376-0).
Springer will contact you if the paper is not in the proposed layout.
Accepted full papers have a page limit of 12 pages, short papers of 8 pages.
Again, please make sure to use the right paper style. Please submit all source
files (LaTeX or Word only) of your paper including a PDF or PS file into one
zip-archive and upload it using your paper ID and password to the submission
system. Only zip-archive will be accepted by the system.

For further details on submission see: www.iess.org

Location
--------
The conference will be held in "Heinz Nixdorf Museum" (HNF), the largest
computer museum in the world, see also www.hnf.de

Organizing Committee
--------------------
General Chairs
Achim Rettberg, Carl v. Ossietzky University, Oldenburg, Germany
Mauro C. Zanella, ZF Friedrichshafen AG, Friedrichshafen, Germany

General Co-Chair
Franz J. Rammig, University Paderborn, Germany

PC Co-Chair
Marcelo Götz, Federal University of Rio Grande do Sul, Brazil
Gunar Schirner, Northeastern University Boston, USA

Local Arrangement Chair:
Achim Rettberg, Carl von Ossietzky University Oldenburg, Germany

Publicity Chair
Marco Wehrmeister, Santa Catarina State University, Brazil

Web Chair:
Tayfun Gezgin, OFFIS - Insitute for Information Technology - Oldenburg, Germany

Finance Chair:
Achim Rettberg, Carl von Ossietzky University Oldenburg, Germany