(sigemb-info 699) COOLChips XVI

--
Eiichi HAYAKAWA
Takushoku University
http://www.cs.takushoku-u.ac.jp/os/

-------------------

奈良先端大の姚駿と申します。

MLをお借りして、COOL Chips XVIの論文募集の
案内を送付させていただきます。
みなさまのご投稿をお待ちしております。

2010から、採択された論文をIEEE XploreにてDOI付きで掲載しております。
また、Best PicksをIEEE MicroのCOOL Chips special issueに推薦することを
行なっており、査読により２、３件程度がIEEE Microの2013年11月/12月の
COOLChips特集号に採録される予定となっております。
皆様にぜひご投稿いただきたいです。

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  IEEE Symposium on Low-Power and High-Speed Chips, COOL Chips XVI
              Yokohama Joho Bunka Center, Yokohama, Japan
      (Yokohama Media & Communications Center, Yokohama, Japan)
                         April 17 - 19, 2013
                      http://www.coolchips.org

                           CALL FOR PAPERS
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PUBLICATIONS:
-- All papers will be published online via IEEE Xplore.
-- Authors of best papers will be recommended to submit an extended
version to a COOL Chips special issue of IEEE Micro.
-- Author of the best paper will be invited to present an invited talk
in Hot Chips, Aug. 2013.

IMPORTANT Dates:
- Technical Papers:
-- Feb. 5th, 2013: Extended Abstract Submission
-- Mar. 11th, 2013: Acceptance Notification

- Posters:
-- Mar. 18th, 2013: Poster Abstract Submission
-- Mar. 26th, 2013: Poster Acceptance Notification
-------------------------------------------------------------------------

COOL Chips is an International Symposium initiated in 1998 to present
advancement of low-power and high-speed chips. The symposium covers
leading-edge technologies in all areas of microprocessors and their
applications. The COOL Chips XVI is to be held in Yokohama on April
17-19, 2013, and is targeted at the architecture, design and
implementation of chips with special emphasis on the areas listed
below.

Contributions are solicited in the following areas:
1. Low Power-High Performance Processors for Multimedia, Digital
Consumer Electronics, Mobile, Graphics, Encryption, Robotics,
Automotive, Networking, Medical, Healthcare, and Biometrics.
2. Novel Architectures and Schemes for Single Core, Multi/Many-Core,
Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous,
Dependable Computing, GALS and Wireless.
3. Cool Software including Parallel Schedulers, Embedded Real-time
Operating System, Binary Translations, Compiler Issues and Low Power
Techniques.

Proposals should consist of a title, an extended abstract (up to 3
pages) describing the product or topic to be presented and the name,
job title, address, phone number, FAX number, and e-mail address of
the presenter. Please prepare the extended abstract using the given
guidelines and template (Author's kit will be uploaded here.)

In the extended abstract, the status of the product or topic should
precisely be described. If this is a not-yet-announced product, and
you would like to keep the submission confidential, please indicate
it. We will do our best to maintain confidentiality.

Proposals will be selected by the program committee's evaluation of
interest to the audience.
Submission should be made by e-mail, to M. Ikeda, Program Chair :
submit_xvi"at"coolchips.org. (Please replace the "at" to @.)

Program Committee:

Chairs
M. Ikeda (Univ.of Tokyo)
F. Arakawa (Renesas)
Vice Chair
J. Yao (NAIST)
H. Shimada (NAIST)
Poster Chair
K. Hashimoto (Fukuoka Univ.)
Special Session Chair
H. Tomiyama (Ritsumeikan Univ.)
Members
A. Ben-Abdallah (Aizu Univ.)
K. -R. Cho (Chungbuk National Univ.)
A. Gupta (Freescale)
Y. Han (Chinese Academy of Science)
T. Harada (Yamagata Univ.)
N. Higaki (Panasonic)
Y. Inoguchi (JAIST)
S. Izumi (Kobe Univ.)
K. Kimura (Waseda Univ.)
T. Kobori (NEC)
T. Kodaka (Toshiba)
Y. Kodama (Univ. of Tsukuba)
M. Kuga (Kumamoto Univ.)
G. Lee (Korea Univ.)
S. -J. Lee (Qualcomm)
K. Morioka (Fujitsu Labs.)
M. Muroyama (Tohoku Univ.)
B. -G. Nam (Chungnam National Univ.)
S. Otani (Renesas)
Y. Shibata (Nagasaki Univ.)
K. Shimamura (Hitach)
H. Takizawa (Tohoku Univ.)
N. Togawa (Waseda Univ.)
T. -H. Tsai (NCU Taiwan)
T. Tsutsumi (Meiji Univ.>
Y. Wada (UEC)
H. Yamauchi (Samsung)
K. S. Yeo (NTU Singapore)

(sigemb-info 699) COOLChips XVI - Call for Papers